We'll bust your caps!
   We'll bust your caps! Friday - 28th April, 2017 - 16:01:01 

Site Menu  
Web News
Case Gallery
Contact Us
About Us


   Review : Copper Heatsink/Fan Roundup »  


Copper Heatsink/Fan Roundup - Preamble
 Date  : Aug 22nd, 2001
 Category  : Cooling
 Manufacturer   : Various
 Author  : Jin-Wei Tioh
More and more manufacturers are using copper in their heatsinks, either as an inlay, for the base plate or even for the entire cooler. In theory, copper is a better thermal conductor than aluminum. But don't go gaga just yet, as the efficiency of the manufacturer's design also weighs in heavily in the cooler's performance. An efficient aluminum or copper-aluminum hybrid design could easily outperform an inefficient copper design. With non-retail boxed or "loose tray" CPUs, DIY PC assembly and the ever increasing power dissipation of the latest CPUs, more end-users are fast becoming aware of this critical system component. The days when end-users had only a handful (literally) of coolers to chose from are long over; the number of manufacturers and their corresponding products are mind-boggling. Don't believe us? Just take a peep at our Sponsors section.

The coolers in this copper roundup are the : Blizzard S370, GlobalWIN CAK-38, Spire 5P53B3, Thermalright SK6, Thermaltake Mini Copper Orb and Zalman CNPS 5000 Plus. We would like to take a moment to thank all the sponsors that have made this roundup possible. The Blizzard was supplied by Blizzard Heatsinks; the CAK-38 by 2CoolTek; the Spire 5P53B3 by ByteCom Fanner B.V.; the SK6 by Thermalright; the Mini Copper Orb by Thermaltake; and the CNPS 5000 Plus by Zalman. Please keep in mind that even though some heatsinks were supplied directly from the manufacturers, there is no bias in this article. Without further ado, let's see the results of the performance test.

These graphs show the temperature delta between the CPU case temperature and the intake air temperature. To maximize CPU power dissipation, we ran StabilityTest, HotCPU Lite and the BlueSmoke RC5-64 Client simultaneously under Windows 2000. The test unit basically consisted of an AMD Duron 800, AOpen AK73 Pro (A) (courtesy of AOpen), a S3 Virge PCI sitting in the last PCI slot and the measuring apparatus (courtesy of HighSpeed PC). The unit was setup on an open tabletop, giving the cooler an ideal functioning environment (ie. unobstructed airflow, minimized recycling of hot air). Air turbulence in the room was virtually non-existant, ensuring that only the fan on the heatsink was doing all the work. Other heat sources (eg. lights, monitors) were also minimized to ensure a more accurate determination of performance results. About the only confounding factor is the heat generated by some of the nearby components, eg. RAM, voltage regulators and the north bridge. Lastly, the primary TIM (thermal interface material) used in the evaluations is Arctic Silver II, kindly supplied by Arctic Silver LLC.

 Print this article Results (C/W)

 E-mail this article

 Discuss this article


Copyright 2000-2005 BlueSmoke. All rights reserved. Terms, Conditions and Privacy Information.
Site Design by Jin-Wei Tioh